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SI10U(S)

特点

● 低CTE,高模量,可有效降低封装基板的翘曲
优异的耐湿热性
良好的PCB加工性
无卤材料

应用领域

  • eMMC, DRAM
  • AP, PA
  • Dual CM
  • Fingerprint, RF Module


  • 产品性能
  • 产品证书
  • 资料下载
Items Condition Unit SI10U(S)
Tg DMA 280
Td 5% wt. loss
>400
CTE (X/Y-axis) Before Tg ppm/℃
10
CTE (Z-axis)
α1/α2 ppm/℃
25/135
Dielectric Constant 1) (1GHz) 2.5.5.9 - 4.4
Dissipation Factor 1) (1GHz)
2.5.5.9 - 0.007
Peel Strength1) 1/3 OZ, VLP Cu N/mm
0.80
Solder Dipping @288℃ min >30
Young's modulus 50℃ GPa 26
Young's modulus
200 GPa
23
Flexural Modulus1) 50℃
GPa
32
Flexural Modulus1)
200
GPa
27
Water Absorption1)
A % 0.14
Water Absorption1) 85℃/85%RH,168Hr %
0.35
Flammability
UL-94 Rating
V-0
Thermal Conductivity - W/(m.K) 0.61
Color - - Black

Remarks:

*Specimen thickness: 0.10mm. Test method is according to IPC-TM-650.

*1): specimen thickness: 0.80mm.

All the typical value listed above isfor your reference only, please turn to Shengyi Technology Co.,Ltd. fordetailed information, and all rights from this data sheet are reserved byShengyi Technology Co.,Ltd.


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