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SP225GN

特点

  • 优良的机械加工能力,可用于冲孔。
  • 提高刚挠结合板的耐翘曲性能。

应用领域

适用于散热板、模腔板和多层刚挠结合板的粘结材料。
  • 产品性能
  • 产品证书
  • 资料下载
Items Method Condition Unit Typical Value
Tg 2.4.25 TMA

190

2.4.24.2 DMA 225
Peel Strength
2.4.8

Copper Foil(1/3oz)

N/mm
0.7
2.4.8
Copper Foil(1/2oz)
N/mm
1.0
2.4.9 CVL N/mm
1.0
T300
2.4.24.1 TMA min >30
Td 2.4.24.6 TGA(5% wt. loss) 410
Thermal Stress
- 288℃, solder dip
s >600
Water Absorption
2.6.2.1 E-1/105+D-24/23 % 0.26
CTE (Z-axis) 2.4.24 TMA (before Tg)
ppm/℃ 34
TMA (After Tg) ppm/℃ 115



Dielectric Constant (RC67%@1GHz) 2.5.5.9 C-24/23/50 - 4.21
Dissipation Factor(RC67%@1GHz)
2.5.5.9
C-24/23/50
- 0.015
Flammability
UL94
C-48/23/50
Rating
V-0

Remarks:

Remarks: Specimen thickness: 0.8mm. Alltypical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd. for detailed information.

Explanations: C=Humidity conditioning;D=Immersion conditioning in distilled water; E=temperature conditioning.

All the typical value listed above is foryour reference only, please turn to Shengyi Technology Co., Ltd. for detailedinformation, and all rights from this data sheet are reserved by ShengyiTechnology Co., Ltd.

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