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Synamic8GN

特点

● 低Dk/Df (10GHz): 3.28/0.0019

● 高Tg 200℃ (DMA)

● 更优异的热可靠性

● 更优异的耐离子迁移性能

● 更低的Z轴热膨胀系数,优异的通孔可靠性

应用领域

● 超高速网络设备

● 服务器、交换机、存储、路由器等

● 高性能计算机

● 高频测量仪器等

● 光通信产品

  • 产品性能
  • 产品证书
  • 资料下载
Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA 200
Td 2.4.24.6 5% wt. loss 430
T288
2.4.24.1 TMA min >120
T300 2.4.24.1
TMA min
>120
Thermal Stress
2.4.13.1
288℃, solder dip
- PASS
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 230
50-260℃ % 2.2
Dissipation Constant
2.5.5.9 (1GHz)
C-24/23/50
- 3.35
2.5.5.5 (10GHz)
C-24/23/50
- 3.28
SPDR (10GHz)
C-24/23/50
- 3.49
Dissipation Factor
2.5.5.9 (1GHz)
C-24/23/50
- 0.0008
2.5.5.5 (10GHz)
C-24/23/50
- 0.0019
SPDR (10GHz)
C-24/23/50
- 0.0021
Peel Strength (1Oz, RTF2/HVLP2) 2.4.8 288℃/10s N/mm [lb/in] 0.82/0.80 [4.7/4.6]
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.10
Flammability
UL94
C-48/23/50
Rating
V-0

Remarks:

Remarks:

1. Allthe typical value is based on the 30mil (6*2116) thickness specimen, but not guaranteedata.

2. All the typicalvalue listed above is for your reference only, please turn to ShengyiTechnology Co., Ltd. for detailed information, and all rights from this datasheet are reserved by Shengyi Technology Co., Ltd.

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