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产品与市场

SG7350D

特点

● 含陶瓷填充之玻纤增强PTFE材料


● 优异的射频性能

● 优异的导热性能

● 在不同频段下具有稳定的介电性能

● 低Z轴CTE及优异的尺寸稳定性

● 兼容无铅制程


应用领域

无源器件;

功率放大器;

微波合成器和功率分配器;

LNA/LNB

  • 产品性能
  • 产品证书
  • 资料下载
Items Method Condition Unit Typical Value
Process Dk IPC-TM-650 2.5.5.5 [1] 10GHz/23℃ - 3.50
Process Df IPC-TM-650 2.5.5.5 [1] 10GHz/23℃ - 0.0019
TcDk IPC-TM-650 2.5.5.5 -25°C to 125°C ppm/°C -14
Volume Resistivity IPC-TM-650 2.5.17.1 A MΩ·cm 5.8 x 106
Surface Resistivity
IPC-TM-650 2.5.17.1
A 2.9 x 107
Td ASTM D3850 TGA (5% W.L) 565
CTE (X/Y/Z-axis) IPC-TM-650 2.4.24 TMA (30-260℃) ppm/℃ 9/8/25
Peel Strength
IPC-TM-650 2.4.8

after solder float

1oz. ED Foil
N/mm [ln/in] 0.90 [5.14]
Water Absorption IPC-TM-650 2.6.2.1 D-24/34 % 0.05
Thermal Conductivity ASTM D5470 100℃ W/m·K 0.80
Flexural Strength (X/Y-axis) IPC-TM-650 2.4.4 A MPa 100/80
Flammability
UL-94 C-48/23/50 Rating V-0

Remarks:

(1) All the typical valueis based on the 0.508mm(0.020”) specimen, and the specification sheet is basedon IPC4103.

(2) Typical values are a representation of anaverage value for the population of the property.  
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