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产品与市场

ST115G

特点

● 散热性好

● 优良的保温、绝缘可靠性

● 较低 Z-axis CTE., 高 CTI

● 无卤,Tg 175℃(DMA)

应用领域

● PCB散热解决方案

● 汽车电子,LED前照灯

● 消费类电子产品(智能终端、SSD)


  • 产品性能
  • 产品证书
  • 资料下载
Items Method Condition Unit Typical Value
Thermal Conductivity ASTM-D5470 A W/ (m?K) 1.6

ASTM E1461 A
2.0
Tg 2.4.25D DSC 170
Td
2.4.24.6 Wt 5% loss 410
Thermal Stress 2.4.13.1 288℃, solder float min
>30
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 37
After Tg ppm/℃ 166
50-260℃ % 2.2
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ/cm 108
Surface Resistivity
2.5.17.1
C-96/35/90 107
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV >45
Peel Strength (1oz) 2.4.8 288℃/10s N/mm 1.05
Flammability
UL94
C-48/23/50
Rating
V-0
Water Absorption IPC-TM-650 2.6.2.1
E-1/105+D-24/23 % 0.11
CTI IEC60112 A Rating PLC0

Remarks:

Remarks:

1. All the typical value is based onthe 1.0mm specimen, while the Tg is for specimen≥0.50mm.

2. All the typical values listed above arefor your reference only and not intended for specification. Please contactShengyi Technology Co., Ltd. for detailed information. All rights from thisdata sheet are reserved by Shengyi Technology Co., Ltd.

3. UL certificated Single/Double sidePCB min. thickness 0.38mm.

Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

Thefirst digit following the letter indicates the duration of preconditioning inhours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.

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